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APA Citation
Elger, G., Kandaswamy, S. V., Liu, E., Hanss, A., Schmid, M., Derix, R., & Conti, F. (2015). analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. Microelectronics journal, 46(12), 1230–1238. http://access.bl.uk/ark:/81055/vdc_100029835619.0x00004e