Cite
HARVARD Citation
Elger, G. et al. (2015). Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. Microelectronics journal. 46 (12), pp. 1230-1238. [Online].
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Elger, G. et al. (2015). Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. Microelectronics journal. 46 (12), pp. 1230-1238. [Online].