Transfer printing of fully formed thin‐film microscale GaAs lasers on silicon with a thermally conductive interface material. Issue 4 (29th May 2015)

• Record Type: Journal Article
• Authors: Sheng, Xing; Robert, Cedric; Wang, Shuodao; Pakeltis, Grace; Corbett, Brian; Rogers, John A.
• Is Part Of: Laser & photonics reviews. Volume 9:Issue 4(2015:Jul.)
• Page Start: L17
• Page End: L22
• Publication Date: 2015-05-29
• Subjects: Lasers -- Periodicals; Photonics -- Periodicals; Lasers -- Périodiques; Photonique -- Périodiques; 621.36
• DOI: 10.1002/lpor.201500016
• Languages: English
• ISSNs: 1863-8880

Abstract

<abstract abstract-type="graphical" xml:lang="en" id="lpor201500016-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p>Fully formed thin‐film microscale GaAs based lasers are integrated onto silicon substrates using a transfer printing method. An indium‐silver alloy based adhesive layer serves as a thermally conductive interface. Experimental and numerical results demonstrate enhanced lasing performance due to advanced thermal management. The device integration strategies provide routes to on‐chip light sources for silicon photonics. <graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgj23thsf0x" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></p> </abstract>