Transfer printing of fully formed thin‐film microscale GaAs lasers on silicon with a thermally conductive interface material. Issue 4 (29th May 2015) - Sheng, Xing
Abstract Fully formed thin‐film microscale GaAs based lasers are integrated onto silicon substrates using a transfer printing method. An indium‐silver alloy based adhesive layer serves as a thermally conductive interface. Experimental and numerical results demonstrate enhanced lasing performance due to advanced thermal management. The device integration strategies provide routes to on‐chip light sources for silicon photonics.