Cite
HARVARD Citation
Imanaka, Y. et al. (n.d.). Nanoparticulated Dense and Stress‐Free Ceramic Thick Film for Material Integration1. Advanced engineering materials. 15 (11), pp. 1129-1135. [Online].
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Imanaka, Y. et al. (n.d.). Nanoparticulated Dense and Stress‐Free Ceramic Thick Film for Material Integration1. Advanced engineering materials. 15 (11), pp. 1129-1135. [Online].