Nanoparticulated Dense and Stress‐Free Ceramic Thick Film for Material Integration1. Issue 11 (3rd September 2013)

• Record Type: Journal Article
• Authors: Imanaka, Yoshihiko; Amada, Hideyuki; Kumasaka, Fumiaki; Takahashi, Norihiko; Yamasaki, Takahiro; Ohfuchi, Mari; Kaneta, Chioko
• Is Part Of: Advanced engineering materials. Volume 15:Issue 11(2013:Nov.)
• Page Start: 1129
• Page End: 1135
• Publication Date: 2013-09-03
• Subjects: Materials -- Periodicals; 620.11
• DOI: 10.1002/adem.201300174
• Languages: English
• ISSNs: 1438-1656

Abstract

<abstract abstract-type="graphical"> <title> <x xml:space="preserve">Abstract</x> </title> <p>A dense, thick, and organic‐binder‐free ceramic film consisting of stress‐free nanoparticles could be obtained at room temperature by making use of the unstable and high‐surface energy amorphous phase on the surface of particles. Photolithography and wet etching can be adapted to the thick ceramic green‐state film. A multilayered structure consisting of various ceramics with different sintering temperatures and Cu wiring can form on a Cu foil below 1000 °C. <boxed-text content-type="graphic" position="anchor" orientation="portrait"><graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgg3t12p2c6" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></boxed-text></p> </abstract>