3D and circuit integration of MEMS. (2021)

• Record Type: Book
• Further Information: Note: Masayoshi Esashi.
• Authors: Esashi, Masayoshi, 1949-
• Editors: Esashi, Masayoshi
• Contents: INTRODUCTION; Chapter 1. Overview; SYSTEM ON CHIP; Chapter 2. Bulk Micromachining; Chapter 3. Poly-Si, Sige Surface Micromachining; Chapter 4. Epitaxial Poly Si Surface Micromachining; Chapter 5. Metal Surface Micromachining; Chapter 6. MEMS Using CMOS Wafer; STACKING; Chapter 7. Anodic Bonding; Chapter 8. Direct Bonding; Chapter 9. Metal Bonding; Chapter 10. Polymer Bonding; Chapter 11. Wafer Transfer; Chapter 12. Through Wafer Interconnection; SEALING AND PACKAGING; Chapter 13. Shell Packaging; Chapter 14. Buried Channels in Monolithic Si; Chapter 15. Episeal; Chapter 16. Metal Seal; Chapter 17. Wafer Level Packaging; Chapter 18. System-in-Package
• Edition: 1st
• Publisher Details: Weinheim : Wiley-VCH
• Publication Date: 2021
• Extent: 1 online resource
• Subjects: 621.38152; Microelectromechanical systems; Silicon-on-insulator technology; Integrated circuits; Metal oxide semiconductors, Complementary
• Languages: English
• ISBNs: 9783527823246; 9783527823253
• Related ISBNs: 9783527346479
• Notes: Note: Description based on CIP data; resource not viewed.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.