Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat Part 20, (14th October 2020)

Record Type:
Book
Title:
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat Part 20, (14th October 2020)
Main Title:
Semiconductor devices. Mechanical and climatic test methods.
Authors:
British Standards Institution,
Issue Display:
Part 20
Part:
20
Issue Sort Value:
0000-0000-0000-0020
Publisher Details:
London : British Standards Institution
Publication Date:
2020
Extent:
1 online resource (32 pages)
Subjects:
602.1841
Plastics
Climate
Thermal testing
Encapsulated
Surface mounting devices
Damp-heat tests
Environmental testing
Electronic equipment and components
Semiconductor devices
Integrated circuits
Soldering
Solderability testing
Mechanical testing
Languages:
English
Related ISBNs:
9780539045840
ISSNs:
3039-4486
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.563720
Ingest File:
03_193.xml