Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices Part 15, (1st October 2020)

Record Type:
Book
Title:
Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices Part 15, (1st October 2020)
Main Title:
Semiconductor devices. Mechanical and climatic test methods.
Authors:
British Standards Institution,
Issue Display:
Part 15
Part:
15
Issue Sort Value:
0000-0000-0000-0015
Publisher Details:
London : British Standards Institution
Publication Date:
2020
Extent:
1 online resource (16 pages)
Subjects:
602.1841
Soldering
Environmental testing
Solderability testing
Slots
Destructive testing
Semiconductor devices
Encapsulated
Holes
Integrated circuits
Climate
Thermal testing
Electronic equipment and components
Mechanical testing
Languages:
English
Related ISBNs:
9780539049374
ISSNs:
3039-5804
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.562350
Ingest File:
03_189.xml