Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used /: a qualitative, non-mathematical explanation of how semiconductors work and how they are used. (2020)
- Record Type:
- Book
- Title:
- Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used /: a qualitative, non-mathematical explanation of how semiconductors work and how they are used. (2020)
- Main Title:
- Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
- Further Information:
- Note: George Domingo.
- Authors:
- Domingo, George, 1937-
- Contents:
- Introduction Chapter 1 – The Bohr Atom Objective of this chapter 1.1– Sinusoidal waves 1.2– The case of the missing lines 1.3– The spectra from gasses and metals 1.4– The elements 1.5– The hydrogen spectrum 1.6– Light is a particle 1.7– The atom’s structure 1.8– The Bohr atom 1.9– Summary/Review Appendix 1.1 – Some details of the Bohr model Appendix 1.2 – Semiconductor materials Chapter 2 – Energy Bands Objective of this chapter 2.1 – Bringing atoms together 2.2 – The insulator 2.3 – The Conductor 2.4 – The semiconductor 2.5 – Digression – A water analogy 2.6 – The mobility of charges Summary and conclusions Appendix 2.1 – Energy gap in Semiconductors Appendix 2.2 – Number of electrons and the Fermi function Chapter 3 – Types of Semiconductor Objectives of this chapter 3.1 – Semiconductor Materials 3.2 – Short summary of semiconductor materials 3.2.1 – Silicon 3.2.2 – Germanium 3.2.3 – Gallium Arsenide 3.3 – Intrinsic Semiconductors 3.4 – Doped Semiconductors - n-type 3.5 – Doped Semiconductors – p-type 3.6 – Additional considerations Conclusion and summary Appendix 3.1 – The Fermi levels in doped semiconductors Appendix 3.2 – Why all donor electrons go to the conduction band Chapter 4 – Infrared detectors Objectives of this chapter 4.1 – What is infrared radiation 4.2 – What our eyes can see 4.3 – infrared Applications 4.4– Types of infrared radiation 4.5 – Extrinsic silicon infrared detectors 4.6 – Intrinsic infrared detectors. Summary and conclusions Appendix 4.1 – LightIntroduction Chapter 1 – The Bohr Atom Objective of this chapter 1.1– Sinusoidal waves 1.2– The case of the missing lines 1.3– The spectra from gasses and metals 1.4– The elements 1.5– The hydrogen spectrum 1.6– Light is a particle 1.7– The atom’s structure 1.8– The Bohr atom 1.9– Summary/Review Appendix 1.1 – Some details of the Bohr model Appendix 1.2 – Semiconductor materials Chapter 2 – Energy Bands Objective of this chapter 2.1 – Bringing atoms together 2.2 – The insulator 2.3 – The Conductor 2.4 – The semiconductor 2.5 – Digression – A water analogy 2.6 – The mobility of charges Summary and conclusions Appendix 2.1 – Energy gap in Semiconductors Appendix 2.2 – Number of electrons and the Fermi function Chapter 3 – Types of Semiconductor Objectives of this chapter 3.1 – Semiconductor Materials 3.2 – Short summary of semiconductor materials 3.2.1 – Silicon 3.2.2 – Germanium 3.2.3 – Gallium Arsenide 3.3 – Intrinsic Semiconductors 3.4 – Doped Semiconductors - n-type 3.5 – Doped Semiconductors – p-type 3.6 – Additional considerations Conclusion and summary Appendix 3.1 – The Fermi levels in doped semiconductors Appendix 3.2 – Why all donor electrons go to the conduction band Chapter 4 – Infrared detectors Objectives of this chapter 4.1 – What is infrared radiation 4.2 – What our eyes can see 4.3 – infrared Applications 4.4– Types of infrared radiation 4.5 – Extrinsic silicon infrared detectors 4.6 – Intrinsic infrared detectors. Summary and conclusions Appendix 4.1 – Light Diffraction Appendix 4.2 – Black Body Radiation Chapter 5 – The pn-junction Objectives of this chapter 5.1 – The pn-junction 5.2 – The Semiconductor Diode 5.3 – The Schottky Diode 5.4 – The Zener or Tunnel Diode Conclusions and Summary Appendix 5.1 – Fermi levels of a pn junction Appendix 5.2 – Diffusion and drift currents Appendix 5.3 – The thickness of the transition region Appendix 5.4 – Work Function and the Shockley diode Chapter 6 – Other Electrical Components Objective of this chapter 6.1 – Voltage and Current 6.2 – The Resistance 6.3 – The Capacitor 6.4 – The Inductor 6.5 – Sinusoidal Voltages 6.6 – Inductor application Conclusions and summary Appendix 6.1 – Impedance and phase changes Chapter 7 – Diode Applications 7.1 – Solar Cells 7.2 – Rectifiers 7.3 – Current Protection 7.4 – Clamping Circuit 7.5 – Voltage Clipper 7.6 – Half-Wave Voltage Doubler 7.7 – Solar Cells Bypass diodes 7.8 – Applications of Shockley Diodes 7.9 – Application of Zener Diodes Conclusion and summary Appendix 7.1 – Details on the voltage doubler Chapter 8 - The Transistors OBCETIVE OF THIS CHAPTER 8.1 – The concept of the transistor 8.2 - The Bipolar Junction Transistor, BJT 8.3 – The Junction Field Effect Transistor, JFET 8.4 – The MOSFET Conclusions and summary Chapter 9 – Transistor Biasing Circuits Objective of this chapter 9.1 - Introduction 9.2 – Emitter Feedback Bias 9.3 – A simple transistor amplifier 9.4 – A fixed bias circuit 9.5 - The Collector bias circuit 9.6 – Power considerations 9.7 – Multi-stage transistor amplifiers 9.8 – Operational amplifier, OpAmp 9.9 – The ideal OpAmp Summary and Conclusions Appendix 9.1 – Derivation of the stability of Collector feedback Chapter 10 – Integrated circuit (IC) fabrication Objective of this chapter 10.1 – The basic material 10.2 – The Boule 10.2.1 - The Czochralski method 10.2.2 – The Flow-Zone method 10.3 – The wafers and epitaxial growth 10.4 – Photolithography 10.5 – The fabrication of a pnp transistor on a silicon waver 10.6 – A digression on doping 10.6.1 – Thermal diffusion 10.6.2 – Implantation 10.7 – Resume our transistor processing 10.7.1 – The contacts 10.7.2 – Metallization 10.7.3 – Multiple interconnects 10.8 – Fabrication of other components 10.8.1 The integrated resistor 10.8.2 The integrated capacitor 10.8.3 Integrated inductor 10.9 – Testing and Packaging 10.10 – Clean rooms 10.11 – Additional thoughts about processing Appendix 10.1 – Miller indices in the diamond structure Chapter 11 – Logic circuits Objectives of this chapter 11.1 – Boolean algebra 11.2 – The logic symbols 11.3 – The electronic inside the symbols 11.3.1 – Diode implementation 11.3.2 – CMOS implementation 11.4- The inverter of NOT circuit 11.5 – The NOR circuit 11.6 – The NAND circuit 11.7 – The XNOR or the exclusive NOR 11.8 – The half adder 11.9 – The full adder 11.10 – Adding more than two digital numbers 11.11 – The subtractor 11.12 – Digression; flip-flops, latches and shifters 11.13 – Multiplication and division of binary numbers 11.14 – Additional comments, speed and power Conclusion and summary Appendix 11.1 – Algebraic formulation of logic modules Appendix 11.2 – Detailed analysis of the full adder Appendix 11.3 – Complementary numbers Appendix 11.4 – Dividing digital numbers Chapter 12 – VLSI components Objectives of this chapter 12.1 – Multiplexers, MUX 12.2 – De-multiplexer, DEMUX 12.3 – Registers 12.4 – Timing and Waveforms 12.5 – Memories 12.5.1 – The Static Random-Access Memory, SRAM 12.5.2 – The Dynamic Random-Access memory, DRAM 12.5.3 – Read Only Memory, ROM 12.5.4 - Programable Read only Memory, PROM 12.6 – Gate arrays Conclusions and summary Appendix 12.1 – A NAND implementation of a 2 to 1 MUX Chapter 13 – Opto-Electronics Objective of this chapter 13.1 – Photoconductors 13.2- PIN diodes 13.3 - Lasers 13.3.1 – The laser action 13.3.2 – Solid State lasers 13.3.3 – Semiconductor Lasers 13.3.4 – Laser applications 13.4 – Light Emitting Diodes, LEDs Summary and Conclusions Appendix 13.1 – The detector readout Chapter 14 – Microprocessors and computers 14.1 – The computer 14.1.1 – The computer architecture 14.1.2 – The Memories 14.1.3 – Input and output units 14.1.4 – The central processing unit, CPU 14.2 – Microcontrollers 14.3 – Liquid Crystal Displays, LCDs 14.3.1 – Liquid Crystal materials 14.3.2 – The contacts 14.3.3 – The color Filters 14. … (more)
- Edition:
- 1st
- Publisher Details:
- Hoboken : John Wiley & Sons, Inc
- Publication Date:
- 2020
- Extent:
- 1 online resource, illustrations (black and white)
- Subjects:
- 621.38152
Semiconductors
Solid state electronics
Electronic apparatus and appliances - Languages:
- English
- ISBNs:
- 9781119597131
- Related ISBNs:
- 9781119597117
- Notes:
- Note: Description based on CIP data; resource not viewed.
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- Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
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- British Library HMNTS - ELD.DS.538675
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