Fundamentals of electromigration-aware integrated circuit design. (2018)

• Record Type: Book
• Further Information: Note: Jens Lienig, Matthias Thiele.
• Authors: Lienig, Jens; (Engineer), Thiele, Matthias
• Contents: Intro; Foreword; Preface; Contents; 1 Introduction; 1.1 Development of Semiconductor Technology; 1.2 Interconnect Development; 1.3 The Rise of Electromigration; 1.4 Motivation and Structure of This Book; References; 2 Fundamentals of Electromigration; 2.1 Introduction; 2.2 Electromigration Quantification Options; 2.3 Design Parameters; 2.3.1 Technology; 2.3.2 Environment; 2.3.3 Design; 2.4 Electromigration Mechanisms; 2.4.1 Crystal Structures and Diffusion Mechanisms; 2.4.2 Barriers of Copper Metallization; 2.4.3 Frequency Dependency of Electromigration; 2.4.4 Mechanical Stress. 2.5 Interaction of Electromigration With Thermal and Stress Migration2.5.1 Thermal Migration; 2.5.2 Stress Migration; 2.5.3 Mutual Interaction of Electromigration, Thermal and Stress Migration; 2.5.4 Differentiation of Electromigration, Thermal and Stress Migration; 2.6 Migration Analysis Through Simulation; 2.6.1 Simulation Techniques; 2.6.2 Atomic-Flux Simulation; 2.6.3 Simulation of Mechanical Stress; 2.6.4 Void-Growth Simulation; References; 3 Integrated Circuit Design and Electromigration; 3.1 Design Flow of Integrated Circuits; 3.2 Electromigration-Aware Design Flows. 3.2.1 Analog Design3.2.2 Digital Design; 3.3 Determination of Currents; 3.3.1 Current Types; 3.3.2 Terminal Currents; 3.3.3 Segment Currents; 3.4 Determination of Current-Density Limits; 3.4.1 Mission Profile; 3.4.2 Application-Robust Current-Density Limits; 3.5 Current-Density Verification; 3.5.1 Methodology; 3.5.2 Current-Required Wire and Via Sizes; 3.5.3 Net Terminal Connections; 3.5.4 Simulation Methods for Electromigration Processes; 3.5.5 Current-Density Simulation; 3.6 Post-Verification Layout Adjustment; 3.7 Design Options for Electromigration Avoidance; References. 4 Mitigating Electromigration in Physical Design4.1 Overview of Presented Measures and Effects; 4.2 Bamboo Effect; 4.2.1 Fundamentals; 4.2.2 Applications; 4.3 Critical Length Effects; 4.3.1 Fundamentals; 4.3.2 Applications; 4.3.3 Linked Segments; 4.4 Via-Below and Via-Above Configurations; 4.4.1 Fundamentals; 4.4.2 Parameters; 4.4.3 Applications; 4.5 Reservoirs; 4.5.1 Fundamentals; 4.5.2 Sources and Sinks; 4.5.3 Reservoir Types; 4.5.4 Applications; 4.6 Multiple Vias; 4.6.1 Fundamentals; 4.6.2 Current Distribution; 4.6.3 Vias With Reservoirs; 4.6.4 Geometrical Configuration; 4.6.5 Applications. 4.7 Frequency-Dependent Effects4.7.1 Self-Healing and Rising Frequencies; 4.7.2 Applications; 4.8 Materials for Classical Metal Routing; 4.8.1 Interconnect; 4.8.2 Dielectric; 4.8.3 Barrier; 4.9 New Materials and Technologies; 4.9.1 Carbon-Based Solutions; 4.9.2 CNT Properties; 4.9.3 Applications; 4.10 Summary; References; 5 Summary and Outlook; 5.1 Summary of Electromigration-Inhibiting Measures; 5.2 Outlook: Segment Lengths; 5.3 Outlook: Library of Electromigration-Robust Elements; 5.4 Outlook: New Technologies; 5.5 Electromigration-Aware Design: Driven by Constraints; References; Index.
• Publisher Details: Cham : Springer
• Publication Date: 2018
• Extent: 1 online resource, illustrations (some color)
• Subjects: 621.3815; Engineering; Integrated circuits -- Design and construction; TECHNOLOGY & ENGINEERING -- Mechanical; Integrated circuits -- Design and construction; Engineering; Circuits and Systems; Electronic Circuits and Devices; Processor Architectures; Electronics and Microelectronics, Instrumentation; Technology & Engineering -- Electronics -- Circuits -- General; Computers -- Systems Architecture -- General; Technology & Engineering -- Electronics -- General; Circuits & components; Computer architecture & logic design; Electronics engineering; Systems engineering; Computer science; Electronics; Electronic books
• Languages: English
• ISBNs: 9783319735580; 3319735586
• Related ISBNs: 9783319735573; 3319735578
• Notes: Note: Online resource; title from PDF title page (EBSCO, viewed March 2, 2018).
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.