Three-Dimensional Integration of Semiconductors : Processing, Materials, and Applications /: Processing, Materials, and Applications. (2015)
- Record Type:
- Book
- Title:
- Three-Dimensional Integration of Semiconductors : Processing, Materials, and Applications /: Processing, Materials, and Applications. (2015)
- Main Title:
- Three-Dimensional Integration of Semiconductors : Processing, Materials, and Applications
- Further Information:
- Note: Edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
- Editors:
- Kondō, Kazuo
Kada, Morihiro
Takahashi, Kenji - Other Names:
- Kondō, Kazuo
- Contents:
- Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.
- Publisher Details:
- Cham : Springer
- Publication Date:
- 2015
- Extent:
- 1 online resource (423 pages)
- Subjects:
- 621.38152
Chemistry
Electrochemistry
Mechanical engineering
Electrical engineering
Biomedical engineering
Chemistry
Electrochemistry
Electrical Engineering
Semiconductors
Mechanical Engineering
Biomedical Engineering
Semiconductors -- Materials
Semiconductors
Biomedical engineering
Chemistry
Electrical engineering
Electrochemistry
Mechanical engineering
Semiconductors
Technology & Engineering -- Electrical
Technology & Engineering -- Electronics -- Semiconductors
Technology & Engineering -- Mechanical
Technology & Engineering -- Engineering (General)
Electrical engineering
Semi-conductors & super-conductors
Mechanical engineering
Biomedical engineering
Computer engineering
Science -- Chemistry -- Physical & Theoretical
Electrochemistry & magnetochemistry
Electronic books - Languages:
- English
- ISBNs:
- 3319186752
9783319186757
9783319186740
3319186744 - Notes:
- Note: Includes bibliographical references at the end of each chapters and index.
Note: Description based on online resource; title from PDF title page (ebrary, viewed August 24, 2016). - Access Rights:
- Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
- Access Usage:
- Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library HMNTS - ELD.DS.361722
- Ingest File:
- 01_326.xml