Handbook of semiconductor interconnection technology. (2006)

• Record Type: Book
• Further Information: Note: Edited by Geraldine C. Schwartz, Kris V. Srikrishnan.
• Other Names: Schwartz, G. C; Srikrishnan, K. V, 1948-
• Contents: METHODS/PRINCIPLES OF DEPOSITION AND ETCHING OF THIN FILMS; Geraldine Cogin Schwartz; Introduction; Evaporation; Chemical Vapor Deposition; Photoenhanced CVD; Plasma Processing; Electrochemical Deposition; Spin Coating; Conclusion; References; CHARACTERIZATION; Geraldine Cogin Schwartz; Introduction; Optical Characterization of Dielectric Films; Infrared (IR) Spectroscopy; Resistivity of Metal Films; Thickness; Dielectric Constant of Dielectrics; Breakdown Strength; Adhesion; Mechanical Properties; Thermal Properties; Auger Electron Spectroscopy (AES); X-Ray Photoelectron Spectroscopy (XPS): Also Called Electron Spectroscopy for Chemical Analysis (ESCA); Secondary Ion Mass Spectroscopy (SIMS); Electron Microprobe; X-Ray Fluorescence Spectrometry (XRFS); Hydrogen Analysis; Rutherford Backscattering Spectrometry (RBS); Specular X-Ray Reflectivity (SXR); Small-Angle Neutron Scattering (SANS); Positronium Annihilation Lifetime Spectroscopy (PALS); Ellipsometric Porosimetry (EP); Scanning Electron Microscope (SEM); Transmission Electron Microscope (TEM); Focused Ion Beam (FIB); Atomic Force Microscope (AFM); Thermal Wave-Modulated Optical Reflectance Imaging (TW); X-Ray Diffraction (XRD); Wet Chemical Methods; Chromatography; Other Analytical Techniques; Thermometry; Electrochemical Methods; Plasma Diagnostics; References; SEMICONDUCTOR CONTACT TECHNOLOGY; David R. Campbell, Revised by Catherine Ivers; Introduction; Importance of Contact Technology; Electrical Aspects of Silicon Contacts; Material Aspects; Ohmic Contacts; Active Device Contacts; Contact Studs for ULSI; Conclusions; References; INTERLEVEL DIELECTRICS; Geraldine Cogin Schwartz and K.V. Srikrishnan; Introduction; Inorganic Dielectric Films; Spin-On Glasses (SOGs); Low Dielectric Constant Films; Barrier Dielectric Film: a-SiC:H; Porous Dielectric Films; Plasma-Assisted Etching of Organic Films; Reactive Ion Etching of Low-e Interlevel Dielectric Films; Conclusions; References; METALLIZATION; Geraldine Cogin Schwartz and K.V. Srikrishnan; Introduction; Aluminum; Aluminum Alloys; Copper; Tungsten; Patterning of Aluminum and Aluminum Alloys; Patterning of Copper; Patterning of Tungsten; Structure of Metal Films; Chapter Summary; References; CHIP INTEGRATION; Geraldine Cogin Schwartz and K.V. Srikrishnan; Introduction; Topography, Step Coverage, and Planarization; Spin-On Films; Step Coverage by Deposited Films; In Situ Planarization/Gap-Fill of Dielectric Films; Etch-Back Processes; Step Coverage, Hole-Fill Planarization of Metals; Evaporation; Sputter Deposition of Metals; Directional Sputtering; High-Density Plasmas; Beam Techniques; Flowage of Metal Films; CVD Metals; Electrochemical Deposition of Copper; Embedment (Inlaid) Processes; Chemical Mechanical Planarization (CMP); CMP of Inorganic Dielectric Films; CMP of Low-e Films; CMP of Metals; Post-CMP Cleaning; Problems with CMP; Impact of CMP; Conclusions on Topography; Remaining Issues for Chip Integration; Process/Structure Choice Conflicts; Processes; Reliability; Manufacturability; Wafer Size; Concluding Remarks on Compatibility of Materials and Processing; References; RELIABILITY; James R. Lloyd and Kenneth P. Rodbell; Introduction; Thin-Film Interconnect Reliability; Behavior of Thin-Film Conductors in Stress Voiding and Electromigration Testing; Electromigration Behavior of Via Chains; Corrosion; Insulator Reliability; Concluding Remarks; References; INDEX
• Edition: 2nd ed
• Publisher Details: Boca Raton, FL : CRC/Taylor & Francis
• Publication Date: 2006
• Extent: 1 online resource (520 pages), illustrations
• Subjects: 621.3815; Interconnects (Integrated circuit technology); Semiconductors -- Design and construction; Semiconductors -- Junctions; TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Integrated; TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- General; Interconnects (Integrated circuit technology); Semiconductors -- Design and construction; Semiconductors -- Junctions; Electronic books
• Languages: English
• ISBNs: 1420017659; 9781420017656
• Related ISBNs: 1574446746; 9781574446746
• Notes: Note: Includes bibliographical references and index.; Note: Print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.