Physical design for 3D integrated circuits. (2016)

• Record Type: Book
• Further Information: Note: Edited by Aida Todri-Sanial, Chuan Seng Tan.
• Editors: Todri-Sanial, Aida; Tan, Chuan Seng
• Contents: 3D INTEGRATION OVERVIEW 2.5D/3D ICs: Drivers, Technology, Applications, and Outlook; Chuan Seng Tan Overview of Physical Design Issues for 3D-Integrated Circuits; Aida Todri-Sanial Detailed Electrical and Reliability Study of Tapered TSVs; Tiantao Lu and Ankur Srivastava 3D Interconnect Extraction; Sung Kyu Lim PHYSICAL DESIGN METHODS FOR 3D INTEGRATION 3D Placement and Routing; Pingqiang Zhou and Sachin S. Sapatnekar Power and Signal Integrity Challenges in 3D Systems-on-Chip; Emre Salman Design Methodology for TSV-Based 3D Clock Networks; Taewhan Kim and Heechun Park Design Methodology for 3D Power Delivery Networks; Aida Todri-Sanial RELIABILITY CONCERNS FOR 3D INTEGRATION Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits; Yu-Guang Chen, Yiyu Shi, and Shih-Chieh Chang Thermal Modeling and Management for 3D Stacked Systems; Tiansheng Zhang, Fulya Kaplan, and Ayse K. Coskun Exploration of the Thermal Design Space in 3D Integrated Circuits; Sumeet S. Kumar, Amir Zjajo, and Rene van Leuken Exploration of the Thermal Design Space in 3D Integrated Circuits; Nizar Dahir, Ra’ed Al-Dujaily, Terrence Mak, and Alex Yakolev TSV-to-Device Noise Analysis and Mitigation Techniques; Brad Gaynor, Nauman Khan, and Soha Hassoun CAD DESIGN TOOLS AND FUTURE DIRECTIONS FOR 3D PHYSICAL DESIGN Overview of 3D CAD Design Tools; Andy Heinig and Robert Fischbach Design Challenges and Solutions for Monolithic 3D ICs; Sung Kyu Lim and Yiyu Shi Design of High-Speed Interconnects for 3D/2.5D ICs without TSVs; Tony Tae-Hyoung Kim and Aung Myat Thu Linn Challenges and Future Directions of 3D Physical Design; Johann Knechtel, Jens Lienig, and Cliff C.N. Sze
• Edition: 1st
• Publisher Details: Boca Raton : CRC Press
• Publication Date: 2016
• Extent: 1 online resource, illustrations (black and white, and colour)
• Subjects: 621.395; Three-dimensional integrated circuits -- Design and construction
• Languages: English
• ISBNs: 9781498710374
• Notes: Note: Description based on CIP data; item not viewed.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.