1. Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF6/O2 plasmas. Issue 9 (3rd April 2017) Authors: Tinck, Stefan; Tillocher, Thomas; Georgieva, Violeta; Dussart, Rémi; Neyts, Erik; Bogaerts, Annemie Journal: Plasma processes and polymers Issue: Volume 14:Issue 9(2017) Page Start: n/a Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗