1. Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers. Issue 14 (1st January 2015) Authors: Miller, Alexander; Yu, Lu; Blickensderfer, Jacob; Akolkar, Rohan Journal: Journal of the Electrochemical Society Issue: Volume 162:Issue 14(2015) Page Start: D630 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers. Issue 14 (27th October 2015) Authors: Miller, Alexander; Yu, Lu; Blickensderfer, Jacob; Akolkar, Rohan Journal: Journal of the Electrochemical Society Issue: Volume 162:Issue 14(2015) Page Start: D630 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗