Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers. Issue 14 (27th October 2015)

• Record Type: Journal Article
• Authors: Miller, Alexander; Yu, Lu; Blickensderfer, Jacob; Akolkar, Rohan
• Is Part Of: Journal of the Electrochemical Society. Volume 162:Issue 14(2015)
• Page Start: D630
• Page End: D634
• Publication Date: 2015-10-27
• Subjects: adhesion -- glass -- metallization; Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/2.1071514jes
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : Metal-to-glass interfaces commonly encountered in electronics and surface finishing applications are prone to failure due to intrinsically weak interfacial adhesion. In the present work, an 'all-wet' process (utilizing solution-phase process steps) is developed for depositing nucleation- and adhesion-promoting layers that enhance the interfacial adhesion between glass substrates and electrochemically-deposited copper (Cu) films. Adhesion between thick (>10 μm) Cu films and the underlying glass substrates is facilitated by an interfacial Pd-TiO2 layer deposited using solution-phase processes. Additionally, the proposed interfacial engineering utilizes self-assembled monolayers to functionalize the glass substrate, thereby improving surface wettability during Pd-TiO2 deposition. Resulting Pd-TiO2 deposits catalyze direct electroless plating of thin Cu seed layers, which enable subsequent electrodeposition of thick (>10 μm) Cu coatings. The present work provides a viable route for high-throughput, cost-effective metallization of glass and ceramic surfaces for electronics and surface finishing applications.