1. Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions. Issue 6 (May 2015) Authors: Mirgkizoudi, M.; Liu, C.; Conway, P.P.; Riches, S. Journal: Microelectronics and reliability Issue: Volume 55:Issue 6(2015) Page Start: 952 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗