1. Effects of Mo nanoparticles addition on the evolution of microstructure in Cu58Bi-xMo/Cu solder joints during aging. (August 2022) Authors: Yang, Linmei; Lu, Xiaolong; Mu, Guowan Journal: Materials today communications Issue: Volume 32(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗