Effects of Mo nanoparticles addition on the evolution of microstructure in Cu58Bi-xMo/Cu solder joints during aging. (August 2022)

• Record Type: Journal Article
• Authors: Yang, Linmei; Lu, Xiaolong; Mu, Guowan
• Is Part Of: Materials today communications. Volume 32(2022)
• Publication Date: 2022-08
• Subjects: Solder joint -- IMC layer -- Microstructure -- Diffusion -- Growth evolution; Materials science -- Periodicals; 620.11
• DOI: 10.1016/j.mtcomm.2022.104025
• Languages: English
• ISSNs: 2352-4928

Abstract

Abstract: A novel composite lead-free solder was prepared by adding Mo nanoparticles in Sn58Bi solder. Microstructure evolution of Sn58Bi-xMo(x = 0, 0.5%, 1%)/Cu solder joints were investigated during aging process at different temperature. The results reveal that Mo nanoparticles significantly inhibited the growth of Cu6 Sn5 compounds layer in solder joints, but had little influence on Cu3 Sn compounds layer. The diffusion coefficients of atoms at different aging temperature were calculated. It was observed that several Cu6 Sn5 compounds layer began to separate and diffuse into solder when Sn58Bi-0.5%Mo/Cu and Sn58Bi-1%Mo/Cu joints were aged for 240 h at 130 ℃. The influence mechanisms of Mo nanoparticles on the growth of Cu6 Sn5 and Cu3 Sn compounds were analyzed. Graphical Abstract: ga1 Highlights: A new composite solder was prepared by adding Mo nanoparticles in Sn58Bi solder. Mo nanoparticles effectively inhibited the growth of IMC layer. Mo nanoparticles inhibited the growth of Cu6 Sn5, but had little influence on Cu3 Sn. Cu6 Sn5 of IMC layer migrated to solder due to the diffusion imbalance. The growth of IMC layer of Sn58Bi-xMo/Cu is explained.