1. Young's modulus of a sintered Cu joint and its influence on thermal stress. (September 2017) Authors: Ishizaki, T.; Miura, D.; Kuno, A.; Hasegawa, K.; Usui, M.; Yamada, Y. Journal: Microelectronics and reliability Issue: Volume 76/77(2017) Page Start: 405 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗