1. Evaluation and modeling of adhesion layer in shock-protection structure for MEMS accelerometer. (November 2016) Authors: Yamane, Daisuke; Konishi, Toshifumi; Safu, Teruaki; Toshiyoshi, Hiroshi; Sone, Masato; Masu, Kazuya; Machida, Katsuyuki Journal: Microelectronics and reliability Issue: Volume 66(2016) Page Start: 78 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗