1. BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (30th July 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (10 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. BS EN IEC 61249-2-51. Materials for printed boards and other interconnecting structures. Part 2-51. Reinforced base materials; clad and unclad. Base materials for Integrated Circuit card carrier tape; unclad (30th July 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (15 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad Part 2-51, (22nd June 2023) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (22 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗