1. Failure signature analysis of power-opens in DDR3 SDRAMs. (September 2018) Authors: Li, Tan; Lee, Hosung; Bak, Geunyong; Baeg, Sanghyeon Journal: Microelectronics and reliability Issue: Volume 88/90(2018) Page Start: 277 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗