11. 22 μm-pitch 9-bit Column-Parallel Overlapping-Subrange SAR (CPOSSAR) ADC. Issue 9 (September 2015) Authors: Wang, Hongtao; Salthouse, Christopher D. Journal: Microelectronics journal Issue: Volume 46:Issue 9(2015) Page Start: 848 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
12. 2μs row time 12-bit column-parallel single slope ADC for high-speed CMOS image sensor. (May 2023) Authors: Wang, Gaoyuan; Chen, Quanmin; Xu, Jiangtao; Nie, Kaiming Journal: Microelectronics journal Issue: Volume 135(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
13. 3D domain wall memory-cell structure, array architecture and operation algorithm with anti-disturbance. (August 2017) Authors: Fu, Yarong; Yang, Kai; Chen, B.A.; Lin, Yinyin Journal: Microelectronics journal Issue: Volume 66(2017) Page Start: 1 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
14. 3D LTCC structure for a large-volume cavity-type chemical microreactor. Issue 3 (3rd August 2015) Authors: Agata Skwarek, Dr; Belavič, Darko; Hrovat, Marko; Makarovič, Kostja; Dolanč, Gregor; Pohar, Andrej; Hočevar, Stanko; Malič, Barbara Journal: Microelectronics international Issue: Volume 32:Issue 3(2015) Page Start: 133 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
15. 3D LTCC structure for a large-volume cavity-type chemical microreactor. Issue 3 (3rd August 2015) Authors: Belavič, Darko; Hrovat, Marko; Makarovič, Kostja; Dolanč, Gregor; Pohar, Andrej; Hočevar, Stanko; Malič, Barbara Editors: Agata Skwarek, Dr Journal: Microelectronics international Issue: Volume 32:Issue 3(2015) Page Start: 133 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
16. 3D system-in-package design using stacked silicon submount technology. Issue 2 (5th May 2015) Authors: Dong, Mingzhi; Santagata, Fabio; Sokolovskij, Robert; Wei, Jia; Yuan, Cadmus; Zhang, Guoqi Journal: Microelectronics international Issue: Volume 32:Issue 2(2015) Page Start: 63 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
17. 3D system-in-package design using stacked silicon submount technology. Issue 2 (5th May 2015) Authors: Dong, Mingzhi; Santagata, Fabio; Sokolovskij, Robert; Wei, Jia; Yuan, Cadmus; Zhang, Guoqi Journal: Microelectronics international Issue: Volume 32:Issue 2(2015) Page Start: 63 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
18. 4H–SiC floating junction Schottky barrier diode with compensation layer of engineered cathode structure: Cone-shaped electric field, current density waveform, and applications. (July 2022) Authors: Nan, Yagong; Han, Genquan Journal: Microelectronics journal Issue: Volume 125(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
19. 4th order capacitively-coupled LC-based ΣΔ modulator. (April 2017) Authors: Belfort, Diomadson R.; Catunda, Sebastian Y.C.; Aboushady, Hassan Journal: Microelectronics journal Issue: Volume 62(2017) Page Start: 99 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
20. 4th order current-mode and transresistance-mode MOSFET-C low-pass filter for multi-standard receivers. (September 2021) Authors: Yesil, Abdullah; Ozenli, Deniz Journal: Microelectronics journal Issue: Volume 115(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗