1. An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect. (15th January 2015) Authors: Yao, Yao; Wang, Yuexing; Keer, Leon M.; Fine, Morris E. Journal: Scripta materialia Issue: Volume 95(2015) Page Start: 7 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect. (15th January 2015) Authors: Yao, Yao; Wang, Yuexing; Keer, Leon M.; Fine, Morris E. Journal: Scripta materialia Issue: Volume 95(2015) Page Start: 7 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗