An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect. (15th January 2015)

• Record Type: Journal Article
• Authors: Yao, Yao; Wang, Yuexing; Keer, Leon M.; Fine, Morris E.
• Is Part Of: Scripta materialia. Volume 95(2015)
• Page Start: 7
• Page End: 10
• Publication Date: 2015-01-15
• Subjects: Electromigration -- High current density -- Solder -- Void -- Analytical solution; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2014.08.028
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract : An analytical solution to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect is developed based on mass diffusion theory. A quantitative nonlinear relation between the void propagation velocity and the shape evolution parameter is obtained. It is found that a circular void will grow at the lowest velocity, but as it collapses to a finger-shaped void it will grow at a faster velocity that is inversely proportional to the width. The void growth velocity predicted is consistent with the experimental observation.