1. Constitutive modeling of solder alloys for drop-impact applications. (December 2016) Authors: Wong, E.H.; Chrisp, J.; Selvanayagam, C.S.; Seah, S.K.W. Journal: Microelectronics and reliability Issue: Volume 67(2016) Page Start: 135 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗