1. A grey-ANN approach for optimizing the QFN component assembly process for smart phone application. Issue 2 (4th April 2016) Authors: Huang, Chien-Yi; Chen, Ching-Hsiang; Lin, Yueh-Hsun Journal: Soldering & surface mount technology Issue: Volume 28:Issue 2(2016) Page Start: 63 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. A method for optimizing stencil cleaning time in solder paste printing process. Issue 4 (2nd September 2019) Authors: Yu, JiangYou; Cao, Le; Fu, Hao; Guo, Jun Journal: Soldering & surface mount technology Issue: Volume 31:Issue 4(2019) Page Start: 233 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. A method for optimizing stencil cleaning time in solder paste printing process. Issue 4 (9th May 2019) Authors: Yu, JiangYou; Cao, Le; Fu, Hao; Guo, Jun Journal: Soldering & surface mount technology Issue: Volume 31:Issue 4(2019) Page Start: 233 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. A method for the tin pest presence testing in SnCu solder alloys. Issue 3 (27th May 2014) Authors: Skwarek, Agata; Kulawik, Jan; Czerwinski, Andrzej; Pluska, Mariusz; Witek, Krzysztof Journal: Soldering & surface mount technology Issue: Volume 26:Issue 3(2014) Page Start: 110 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. A method for the tin pest presence testing in SnCu solder alloys. Issue 3 (27th May 2014) Authors: Skwarek, Agata; Kulawik, Jan; Czerwinski, Andrzej; Pluska, Mariusz; Witek, Krzysztof Journal: Soldering & surface mount technology Issue: Volume 26:Issue 3(2014) Page Start: 110 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. A new approach to investigate conductive anodic filament (CAF) formation. Issue 1 (2nd February 2015) Authors: Zou, Ling Chunxian; Hunt, Chris Journal: Soldering & surface mount technology Issue: Volume 27:Issue 1(2015) Page Start: 22 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. A new approach to investigate conductive anodic filament (CAF) formation. Issue 1 (2nd February 2015) Authors: Zou, Ling Chunxian; Hunt, Chris Journal: Soldering & surface mount technology Issue: Volume 27:Issue 1(2015) Page Start: 22 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. A review: lead free solder and its wettability properties. Issue 3 (6th June 2016) Authors: Mhd Noor, Ervina Efzan; Mhd Nasir, Nur Faziera; Idris, Siti Rabiatul Aisya Journal: Soldering & surface mount technology Issue: Volume 28:Issue 3(2016) Page Start: 125 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. A review: lead free solder and its wettability properties. Issue 3 (6th June 2016) Authors: Mhd Noor, Ervina Efzan; Mhd Nasir, Nur Faziera; Idris, Siti Rabiatul Aisya Journal: Soldering & surface mount technology Issue: Volume 28:Issue 3(2016) Page Start: 125 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics. Issue 2 (14th October 2019) Authors: Aamir, Muhammad; Muhammad, Riaz; Tolouei-Rad, Majid; Giasin, Khaled; Silberschmidt, Vadim V. Journal: Soldering & surface mount technology Issue: Volume 32:Issue 2(2020) Page Start: 115 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗