31. Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specifications. Issue 4 (3rd September 2018) Authors: Huang, Chien-Yi Journal: Soldering & surface mount technology Issue: Volume 30:Issue 4(2018) Page Start: 217 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
32. Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specifications. Issue 4 (7th June 2018) Authors: Huang, Chien-Yi Journal: Soldering & surface mount technology Issue: Volume 30:Issue 4(2018) Page Start: 217 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
33. Automatic optical inspection system for IC solder joint based on local-to-global ensemble learning. Issue 2 (29th June 2020) Authors: Chen, Wenjie; Cai, Nian; Wang, Huiheng; Lin, Jianfa; Wang, Han Journal: Soldering & surface mount technology Issue: Volume 33:Issue 2(2021) Page Start: 65 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
34. Automatic optical inspection system for IC solder joint based on local-to-global ensemble learning. Issue 2 (9th July 2020) Authors: Chen, Wenjie; Cai, Nian; Wang, Huiheng; Lin, Jianfa; Wang, Han Journal: Soldering & surface mount technology Issue: Volume 33:Issue 2(2021) Page Start: 65 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
35. Bonding of Si chips to low carbon steel boards using electroplated Sn solder. Issue 4 (29th May 2018) Authors: Hsu, Shou-Jen; Lee, Chin C. Journal: Soldering & surface mount technology Issue: Volume 30:Issue 4(2018) Page Start: 213 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
36. Bonding of Si chips to low carbon steel boards using electroplated Sn solder. Issue 4 (3rd September 2018) Authors: Hsu, Shou-Jen; Lee, Chin C. Journal: Soldering & surface mount technology Issue: Volume 30:Issue 4(2018) Page Start: 213 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
37. Bonding of zero-shrink LTCC with alumina ceramics. Issue 4 (7th September 2015) Authors: Somer, Jakub; Štekovič, Michal; Urban, František; Šandera, Josef; Szendiuch, Ivan Journal: Soldering & surface mount technology Issue: Volume 27:Issue 4(2015) Page Start: 157 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
38. Bonding of zero-shrink LTCC with alumina ceramics. Issue 4 (7th September 2015) Authors: Somer, Jakub; Štekovič, Michal; Urban, František; Šandera, Josef; Szendiuch, Ivan Journal: Soldering & surface mount technology Issue: Volume 27:Issue 4(2015) Page Start: 157 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
39. Characterisation of Cu/Cu bonding using self-assembled monolayer. Issue 2 (3rd April 2018) Authors: Lykova, Maria; Panchenko, Iuliana; Künzelmann, Ulrich; Reif, Johanna; Geidel, Marion; Wolf, M. Jürgen; Lang, Klaus-Dieter Journal: Soldering & surface mount technology Issue: Volume 30:Issue 2(2018) Page Start: 106 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
40. Characterisation of Cu/Cu bonding using self-assembled monolayer. Issue 2 (8th March 2018) Authors: Lykova, Maria; Panchenko, Iuliana; Künzelmann, Ulrich; Reif, Johanna; Geidel, Marion; Wolf, M. Jürgen; Lang, Klaus-Dieter Journal: Soldering & surface mount technology Issue: Volume 30:Issue 2(2018) Page Start: 106 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗