3311. Wafer level fabrication of single cell dispenser chips with integrated electrodes for particle detection. (22nd January 2015) Authors: Schoendube, Jonas; Yusof, Azmi; Kalkandjiev, Kiril; Zengerle, Roland; Koltay, Peter Journal: Journal of micromechanics and microengineering Issue: Volume 25:Number 2(2015:Feb.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3312. Wafer level hermetic bonding and packaging using recrystallized parylene. (1st January 2023) Authors: Maharshi, Vikram; Ahmad, Imran; Agarwal, Ajay; Mitra, Bhaskar Journal: Journal of micromechanics and microengineering Issue: Volume 33:Number 1(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3313. Wafer-level Cu–Sn micro-joints with high mechanical strength and low Sn overflow. (6th August 2015) Authors: Duan, Ani; Luu, Thi-Thuy; Wang, Kaiying; Aasmundtveit, Knut; Hoivik, Nils Journal: Journal of micromechanics and microengineering Issue: Volume 25:Number 9(2015:Sep.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3314. Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting. (30th November 2016) Authors: Al Farisi, Muhammad Salman; Hirano, Hideki; Frömel, Jörg; Tanaka, Shuji Journal: Journal of micromechanics and microengineering Issue: Volume 27:Number 1(2017:Jan.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3315. Wafer-level hermetic vacuum packaging by bonding with a copper–tin thin film sealing ring. (15th February 2018) Authors: Akashi, Teruhisa; Funabashi, Hirofumi; Takagi, Hideki; Omura, Yoshiteru; Hata, Yoshiyuki Journal: Journal of micromechanics and microengineering Issue: Volume 28:Number 4(2018:Apr.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3316. Wafer-scale fabrication of self-actuated piezoelectric nanoelectromechanical resonators based on lead zirconate titanate (PZT). (30th January 2015) Authors: Dezest, D; Thomas, O; Mathieu, F; Mazenq, L; Soyer, C; Costecalde, J; Remiens, D; Deü, J F; Nicu, L Journal: Journal of micromechanics and microengineering Issue: Volume 25:Number 3(2015:Mar.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3317. Wafer–to–wafer transfer process of barium strontium titanate for frequency tuning applications using laser pre-irradiation. (11th February 2015) Authors: Samoto, Tetuo; Hirano, Hideki; Somekawa, Toshihiro; Hikichi, Kousuke; Fujita, Masayuki; Esashi, Masayoshi; Tanaka, Shuji Journal: Journal of micromechanics and microengineering Issue: Volume 25:Number 3(2015:Mar.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3318. WAF‐Based Chinese Character Recognition for Spam Image Filtering. Issue 5 (1st September 2018) Authors: LI, Siyuan; LI, Ruiguang; XU, Yuan; ZHOU, Hao; YAN, Hanbing; XU, Bin; ZHANG, Honggang Journal: Chinese journal of electronics Issue: Volume 27:Issue 5(2018) Page Start: 1050 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3319. Wax transfer printing to enable robust barrier definition in devices based on non-standard porous materials. (29th March 2017) Authors: To, Anthony; Downs, Corey; Fu, Elain Journal: Journal of micromechanics and microengineering Issue: Volume 27:Number 5(2017:May) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3320. WCM‐WTrA: A Cross‐Project Defect Prediction Method Based on Feature Selection and Distance‐Weight Transfer Learning. Issue 2 (1st March 2022) Authors: LEI, Tianwei; XUE, Jingfeng; WANG, Yong; NIU, Zequn; SHI, Zhiwei; ZHANG, Yu Journal: Chinese journal of electronics Issue: Volume 31:Issue 2(2022) Page Start: 354 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗