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Subject 537

43. 2D Semiconductors: Interfacial Band Engineering of MoS2/Gold Interfaces Using Pyrimidine‐Containing Self‐Assembled Monolayers: Toward Contact‐Resistance‐Free Bottom‐Contacts (Adv. Electron. Mater. 5/2020). (11th May 2020)

Authors:
Matković, Aleksandar; Petritz, Andreas; Schider, Gerburg; Krammer, Markus; Kratzer, Markus; Karner‐Petritz, Esther; Fian, Alexander; Gold, Herbert; Gärtner, Michael; Terfort, Andreas; Teichert, Christian; Zojer, Egbert; Zojer, Karin; Stadlober, Barbara
Journal:
Advanced Electronic Materials
Issue:
Volume 6:Number 5(2020)
Page Start:
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Record Type:
Journal Article
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44. 2D Single‐Layer π‐Conjugated Nickel Bis(dithiolene) Complex: A Good‐Electron‐Poor‐Phonon Thermoelectric Material. (1st March 2019)

Authors:
Deng, Tianqi; Yong, Xue; Shi, Wen; Gan, Chee Kwan; Li, Wu; Hippalgaonkar, Kedar; Zheng, Jin‐Cheng; Wang, Xiaobai; Yang, Shuo‐Wang; Wang, Jian‐Sheng; Wu, Gang
Journal:
Advanced Electronic Materials
Issue:
Volume 5:Number 4(2019)
Page Start:
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Record Type:
Journal Article
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46. 2D Transistors: Vertical Integration of 2D Building Blocks for All‐2D Electronics (Adv. Electron. Mater. 12/2020). (9th December 2020)

Authors:
Tang, Jian; Wang, Qinqin; Wei, Zheng; Shen, Cheng; Lu, Xiaobo; Wang, Shuopei; Zhao, Yanchong; Liu, Jieying; Li, Na; Chu, Yanbang; Tian, Jinpeng; Wu, Fanfan; Yang, Wei; He, Congli; Yang, Rong; Shi, Dongxia; Watanabe, Kenji; Taniguchi, Takashi; Zhang, Guangyu
Journal:
Advanced Electronic Materials
Issue:
Volume 6:Number 12(2020)
Page Start:
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Record Type:
Journal Article
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