Journal: Soldering & surface mount technology - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Journal Soldering & surface mount technology

371. Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle. Issue 3 (6th June 2016)

Authors:: Chen, Guang; Liu, Li; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
Journal:: Soldering & surface mount technology
Issue:: Volume 28:Issue 3(2016)
Page Start:: 159
Record Type:: Journal Article
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372. Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys. Issue 3 (27th May 2014)

Authors:: Efzan Mhd Noor, Ervina; Singh, Amares
Journal:: Soldering & surface mount technology
Issue:: Volume 26:Issue 3(2014)
Page Start:: 147
Record Type:: Journal Article
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373. Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys. Issue 3 (27th May 2014)

Authors:: Efzan Mhd Noor, Ervina; Singh, Amares
Journal:: Soldering & surface mount technology
Issue:: Volume 26:Issue 3(2014)
Page Start:: 147
Record Type:: Journal Article
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374. Rheological characterization of non-Brownian suspensions based on structure kinetics. Issue 1 (5th February 2018)

Authors:: Vachaparambil, Kurian J.; Mårtensson, Gustaf; Essén, Lars
Journal:: Soldering & surface mount technology
Issue:: Volume 30:Issue 1(2018)
Page Start:: 57
Record Type:: Journal Article
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375. Rheological characterization of non-Brownian suspensions based on structure kinetics. Issue 1 (9th January 2018)

Authors:: Vachaparambil, Kurian J.; Mårtensson, Gustaf; Essén, Lars
Journal:: Soldering & surface mount technology
Issue:: Volume 30:Issue 1(2018)
Page Start:: 57
Record Type:: Journal Article
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376. Rheology of F620 solder paste and flux. Issue 2 (18th December 2018)

Authors:: Barbosa, Flavia V.; Teixeira, José C.F.; Teixeira, Senhorinha F.C.F.; Lima, Rui A.M.M.; Soares, Delfim F.; Pinho, Diana M.D.
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 125
Record Type:: Journal Article
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377. Rheology of F620 solder paste and flux. Issue 2 (1st April 2019)

Authors:: Barbosa, Flavia V.; Teixeira, José C.F.; Teixeira, Senhorinha F.C.F.; Lima, Rui A.M.M.; Soares, Delfim F.; Pinho, Diana M.D.
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 125
Record Type:: Journal Article
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378. Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems. Issue 4 (1st March 2021)

Authors:: Siswanto, Waluyo Adi; Borodin, Kirill; Mahmoud, Zaid Hamid; Surendar, A.; Sajjadifar, Sami; Abdilova, Galiya; Chang, Jun
Journal:: Soldering & surface mount technology
Issue:: Volume 33:Issue 4(2021)
Page Start:: 232
Record Type:: Journal Article
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379. SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly. Issue 1 (5th February 2018)

Authors:: Che Ani, Fakhrozi; Jalar, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Ismail, Roslina; Bachok, Zuraihana; Abas, Mohamad Aizat; Othman, Norinsan Kamil
Journal:: Soldering & surface mount technology
Issue:: Volume 30:Issue 1(2018)
Page Start:: 1
Record Type:: Journal Article
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380. SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly. Issue 1 (9th January 2018)

Authors:: Che Ani, Fakhrozi; Jalar, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Ismail, Roslina; Bachok, Zuraihana; Abas, Mohamad Aizat; Othman, Norinsan Kamil
Journal:: Soldering & surface mount technology
Issue:: Volume 30:Issue 1(2018)
Page Start:: 1
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗