Journal: Soldering & surface mount technology - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Journal Soldering & surface mount technology

1. A grey-ANN approach for optimizing the QFN component assembly process for smart phone application. Issue 2 (4th April 2016)

Authors:: Huang, Chien-Yi; Chen, Ching-Hsiang; Lin, Yueh-Hsun
Journal:: Soldering & surface mount technology
Issue:: Volume 28:Issue 2(2016)
Page Start:: 63
Record Type:: Journal Article
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2. A method for optimizing stencil cleaning time in solder paste printing process. Issue 4 (2nd September 2019)

Authors:: Yu, JiangYou; Cao, Le; Fu, Hao; Guo, Jun
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 4(2019)
Page Start:: 233
Record Type:: Journal Article
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3. A method for optimizing stencil cleaning time in solder paste printing process. Issue 4 (9th May 2019)

Authors:: Yu, JiangYou; Cao, Le; Fu, Hao; Guo, Jun
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 4(2019)
Page Start:: 233
Record Type:: Journal Article
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4. A method for the tin pest presence testing in SnCu solder alloys. Issue 3 (27th May 2014)

Authors:: Skwarek, Agata; Kulawik, Jan; Czerwinski, Andrzej; Pluska, Mariusz; Witek, Krzysztof
Journal:: Soldering & surface mount technology
Issue:: Volume 26:Issue 3(2014)
Page Start:: 110
Record Type:: Journal Article
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5. A method for the tin pest presence testing in SnCu solder alloys. Issue 3 (27th May 2014)

Authors:: Skwarek, Agata; Kulawik, Jan; Czerwinski, Andrzej; Pluska, Mariusz; Witek, Krzysztof
Journal:: Soldering & surface mount technology
Issue:: Volume 26:Issue 3(2014)
Page Start:: 110
Record Type:: Journal Article
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6. A new approach to investigate conductive anodic filament (CAF) formation. Issue 1 (2nd February 2015)

Authors:: Zou, Ling Chunxian; Hunt, Chris
Journal:: Soldering & surface mount technology
Issue:: Volume 27:Issue 1(2015)
Page Start:: 22
Record Type:: Journal Article
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7. A new approach to investigate conductive anodic filament (CAF) formation. Issue 1 (2nd February 2015)

Authors:: Zou, Ling Chunxian; Hunt, Chris
Journal:: Soldering & surface mount technology
Issue:: Volume 27:Issue 1(2015)
Page Start:: 22
Record Type:: Journal Article
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8. A review: lead free solder and its wettability properties. Issue 3 (6th June 2016)

Authors:: Mhd Noor, Ervina Efzan; Mhd Nasir, Nur Faziera; Idris, Siti Rabiatul Aisya
Journal:: Soldering & surface mount technology
Issue:: Volume 28:Issue 3(2016)
Page Start:: 125
Record Type:: Journal Article
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9. A review: lead free solder and its wettability properties. Issue 3 (6th June 2016)

Authors:: Mhd Noor, Ervina Efzan; Mhd Nasir, Nur Faziera; Idris, Siti Rabiatul Aisya
Journal:: Soldering & surface mount technology
Issue:: Volume 28:Issue 3(2016)
Page Start:: 125
Record Type:: Journal Article
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10. A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics. Issue 2 (14th October 2019)

Authors:: Aamir, Muhammad; Muhammad, Riaz; Tolouei-Rad, Majid; Giasin, Khaled; Silberschmidt, Vadim V.
Journal:: Soldering & surface mount technology
Issue:: Volume 32:Issue 2(2020)
Page Start:: 115
Record Type:: Journal Article
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