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- 671.5605 16
- Brazing -- Periodicals 16
- Solder and soldering -- Periodicals 16
- Assembly -- Reflow soldering -- Solder paste -- SMD 2
- IMC -- Cu/Sn interface -- Cu6Sn5 grain coarsening index -- Cu6Sn5 layer growth index -- Dipping method 2
- Intermetallic compounds -- IMC -- Solder alloys -- Diffusion -- Reflow soldering -- Sn-Zn 2
- Lead-free solder -- SAC305 -- Nanoindentation -- Deformation behaviour -- Micromechanical properties -- Tensile test 2
- Machine learning -- Gradient boosted decision trees -- Pin-in-paste technology -- Predicting quality of reflow assembly -- Solder paste hole-filling 2
- Microstructure -- Wettability -- Lead-free solder -- Microhardness -- Mn nanoparticles 2
- Reliability -- Analysis of variance (ANOVA) -- Ball grid array (BGA) -- Analytical solution 2