Is Part Of: Microelectronics and reliability. Volume 96(2019) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 96(2019)

1. Adaptive simulation-based framework for error characterization of inexact circuits. (May 2019)

Authors:: Bonnot, Justine; Camus, Vincent; Desnos, Karol; Menard, Daniel
Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: 60
Record Type:: Journal Article
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2. Editorial Board. (May 2019)

Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: ii
Record Type:: Journal Article
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3. Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship. (May 2019)

Authors:: Huang, Bau-Chin; Yang, Cheng-Hsien; Lee, Cheng-Yu; Hu, Yu-Lung; Hsu, Chi-Chang; Ho, Cheng-En
Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: 71
Record Type:: Journal Article
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4. Enhanced multiple-error resilient carry look-ahead adders through new customized fault-tolerant voters. (May 2019)

Authors:: Valinataj, Mojtaba
Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: 7
Record Type:: Journal Article
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5. Improvement of the tolerated raw bit error rate in NAND flash-based SSDs with selective refresh. (May 2019)

Authors:: Farjallah, Emna; Armani, Jean-Marc; Gherman, Valentin; Dilillo, Luigi
Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: 37
Record Type:: Journal Article
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6. Investigation of the interfacial reactions between Sn-3.0 wt%Ag-0.5 wt%Cu solder and CuTi alloy (C1990HP). (May 2019)

Authors:: Yen, Yee-Wen; Laksono, Andromeda Dwi; Yang, Chiao-Yi
Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: 29
Record Type:: Journal Article
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7. Limitation of switching-self-clamping-mode "SSCM" in high voltage IGBTs. (May 2019)

Authors:: Wang, Cailin; Yang, Wuhua; Yang, Jing; Zhang, Lei; Zhang, Ruliang
Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: 1
Record Type:: Journal Article
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8. Modeling simplification for thermal mechanical stress analysis of TSV interposer stack. (May 2019)

Authors:: Xia, Kequan; Zhu, Zhiyuan; Zhang, Hongze; Xu, Zhiwei
Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: 46
Record Type:: Journal Article
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9. Performance reliability of ultra-thin Si-SiO2, Si-Al2O3, Si-ZrO2 and Si-HfO2 interface in rectangular steep retrograded nano-regimes devices. (May 2019)

Authors:: Thakur, Rajiv Ranjan; Singh, Pragati
Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: 21
Record Type:: Journal Article
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10. Transient-error correction system with real-time logic switching inspired from attractor-conversion characteristics of a cancer cell. (May 2019)

Authors:: Yang, Isaak; Cho, Kwang-Hyun
Journal:: Microelectronics and reliability
Issue:: Volume 96(2019)
Page Start:: 51
Record Type:: Journal Article
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