Is Part Of: Microelectronics and reliability. Volume 55:Issue 2(2015) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 55:Issue 2(2015)

1. A novel mechanical diced trench structure for warpage reduction in wafer level packaging process. Issue 2 (February 2015)

Authors:: Zhu, Chunsheng; Li, Heng; Xu, Gaowei; Luo, Le
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 418
Record Type:: Journal Article
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2. A physical model on electron mobility in InGaAs nMOSFETs with stacked gate dielectric. Issue 2 (February 2015)

Authors:: Huang, Y.; Xu, J.P.; Wang, L.S.; Zhu, S.Y.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 342
Record Type:: Journal Article
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3. A practical metric for soft error vulnerability analysis of combinational circuits. Issue 2 (February 2015)

Authors:: Raji, Mohsen; Pedram, Hossein; Ghavami, Behnam
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 448
Record Type:: Journal Article
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4. A unified look at the use of successive differentiation and integration in MOSFET model parameter extraction. Issue 2 (February 2015)

Authors:: García-Sánchez, Francisco J.; Ortiz-Conde, Adelmo; Muci, Juan; Sucre-González, Andrea; Liou, Juin J.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 293
Record Type:: Journal Article
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5. All-digital thermal distribution measurement on field programmable gate array using ring oscillators. Issue 2 (February 2015)

Authors:: Yue, Yuan; Feng, Shi-Wei; Guo, Chun-Sheng; Yan, Xin; Feng, Rui-Rui
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 396
Record Type:: Journal Article
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6. Book review. Issue 2 (February 2015)

Authors:: Manić, Ivica
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 461
Record Type:: Journal Article
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7. Case study: Root cause of fluorine detection during TiN ARC layer corrosion of AlSiCu metal lines. Issue 2 (February 2015)

Authors:: Naoe, Takuya
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 411
Record Type:: Journal Article
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8. Electron transport mechanism of tungsten trioxide powder thin film studied by investigating effect of annealing on resistivity. Issue 2 (February 2015)

Authors:: Li, Wei; Sasaki, Akito; Oozu, Hideyuki; Aoki, Katsuaki; Kakushima, Kuniyuki; Kataoka, Yoshinori; Nishiyama, Akira; Sugii, Nobuyuki; Wakabayashi, Hitoshi; Tsutsui, Kazuo; Natori, Kenji; Iwai, Hiroshi
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 407
Record Type:: Journal Article
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9. High speed test interface module using MEMS technology. Issue 2 (February 2015)

Authors:: Kandalaft, Nabeeh; Attaran, Ali; Rashizadeh, Rashid
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 374
Record Type:: Journal Article
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10. Impact of the lateral straggle on the Analog and RF performance of TFET. Issue 2 (February 2015)

Authors:: Ghosh, Sayani; Koley, Kalyan; Sarkar, Chandan K.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 2(2015)
Page Start:: 326
Record Type:: Journal Article
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