Is Part Of: Microelectronics and reliability. Volume 129(2022) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 129(2022)

1. A comparative analysis of printed circuit drying methods for the reliability of assembly process. (February 2022)

Authors:: Ciszewski, Piotr; Sochacki, Mariusz; Stęplewski, Wojciech; Kościelski, Marek; Araźna, Aneta; Janeczek, Kamil
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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2. A cost-effective repair scheme for clustered TSV defects in 3D ICs. (February 2022)

Authors:: Maity, Dilip Kumar; Roy, Surajit Kumar; Giri, Chandan
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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3. Analysis of radiation effect of a novel SOI-Like LDMOS structure. (February 2022)

Authors:: Yang, Yang; Wang, Ying; Yu, Cheng-Hao; Bao, Meng-Tian; Cao, Fei
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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4. Analysis on damage and failure behavior of printed silver wires under high-density current loading. (February 2022)

Authors:: Sun, Quan; Lu, Yebo; Tang, Chengli; Li, Chao; Zuo, Chuncheng
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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5. Development of solderable layer on power MOSFET for double-side bonding. (February 2022)

Authors:: Kim, Dajung; Won, Mi So; Jang, Jeongki; Kim, Sooseong; Oh, Chulmin
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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6. Editorial Board. (February 2022)

Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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Record Type:: Journal Article
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7. Effective (Pd, Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad. (February 2022)

Authors:: Kim, Jungsoo; Park, Dae-Young; Ahn, Byeongjin; Bang, Junghwan; Kim, Min-Su; Park, Hyun-Soon; Sohn, Yoonchul; Ko, Yong-Ho
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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8. Electro-thermal coupling and performance estimation of LEDs at system level. (February 2022)

Authors:: Meng, Haotian; Kong, Fanmin; Li, Kang
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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9. Finite element method modeling of temperature gradient-induced Cu atomic thermomigration in Cu/Sn/Cu micro solder joint. (February 2022)

Authors:: Bai, Tianyue; Qiao, Yuanyuan; Wang, Xudong; Zhao, Ning
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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10. Gate-oxide-short defect analysis and fault modeling in FinFETs. (February 2022)

Authors:: Dibaj, Roya; Al-Khalili, Dhamin; Shams, Maitham; Adham, Saman
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
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Record Type:: Journal Article
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