Is Part Of: Microelectronics and reliability. Volume 128(2022) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 128(2022)

1. A new technique to check the correct mounting of the power module heatsinks. (January 2022)

Authors:: Quitadamo, Matteo Vincenzo; Piumatti, Davide; Raviola, Erica; Fiori, Franco; Sonza Reorda, Matteo
Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

2. A transport model describing how defect accumulation leads to intrinsic dielectric breakdown and post-breakdown conduction. (January 2022)

Authors:: Xu, Yueming; Lu, Toh-Ming; Plawsky, Joel L.
Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

3. An improved accelerated degradation model for LED reliability assessment with self-heating impacts. (January 2022)

Authors:: Truong, Minh-Tuan; Do, Phuc; Mendizabal, Laurent; Iung, Benoit
Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

4. Automotive optoelectronic components submitted to thermal shock: Impact of component architecture on mechanical reliability. (January 2022)

Authors:: NOCAIRI, Safa; Maarouf, Khalil; Roucoules, Christine; Kermouche, Guillaume; Sao-Joao, Sergio; Klöcker, Helmut
Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

5. Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects. (January 2022)

Authors:: Tsai, M.Y.; Huang, P.S.
Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

6. Developed non-destructive verification methods for accelerated temperature cycling of power MOSFETs. (January 2022)

Authors:: Jang, You-Cheol; Kim, Hyo Eun; Schuck, Ariadna; Kim, Yong-Sang
Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

7. Editorial Board. (January 2022)

Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

8. Effect of indentation depth and strain rate on mechanical properties of Sn0.3Ag0.7Cu. (January 2022)

Authors:: Niu, Xiaoyan; Dong, Guoqiang; Li, Xiaomeng; Geng, Xuchen; Zhou, Jiang
Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

9. Electron-beam-induced current (EBIC) imaging technique to quicken polysilicon defect localization in MOSFETs. (January 2022)

Authors:: Zheng, Shijun; Chen, Ran; Yang, Jianli; Wang, Yanfen; Che, Yi; Du, Mei; Tian, Li; Zhai, Lin; Li, Jinglong
Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

10. Heavy-ion induced single event effects and latent damages in SiC power MOSFETs. (January 2022)

Authors:: Martinella, C.; Natzke, P.; Alia, R.G.; Kadi, Y.; Niskanen, K.; Rossi, M.; Jaatinen, J.; Kettunen, H.; Tsibizov, A.; Grossner, U.; Javanainen, A.
Journal:: Microelectronics and reliability
Issue:: Volume 128(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗