Is Part Of: Microelectronics and reliability. Volume 121(2021) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 121(2021)

1. A reliability assessment approach for a Hodgkin-Huxley neuron circuit. (June 2021)

Authors:: Sun, Bo; Guo, Chunbing; Cui, Chengqiang; Zhang, Guohao
Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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Record Type:: Journal Article
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2. A remaining useful life prediction method of IGBT based on online status data. (June 2021)

Authors:: Zhang, Jinli; Hu, Jinbao; You, Hailong; Jia, Renxu; Wang, Xiaowen; Zhang, Xiaowen
Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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3. Automated abstraction of nonlinear analog circuits to reliable set-valued models with reduced overapproximation. (June 2021)

Authors:: Rechmal-Lesse, Malgorzata; Adhisantoso, Yeremia Gunawan; Koroa, Gerald Alexander; Olbrich, Markus
Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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4. Crack identification and evaluation in BEoL stacks of two different samples utilizing acoustic emission testing and nano X-ray computed tomography. (June 2021)

Authors:: Silomon, Jendrik; Gluch, Jürgen; Clausner, André; Paul, Jens; Zschech, Ehrenfried
Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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5. Editorial Board. (June 2021)

Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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6. Evaluating the moisture resistance of Y3Al5O12: Ce3+ phosphor used in high power white LED packaging. (June 2021)

Authors:: Yuan, Weiyi; Fan, Jiajie; Dong, Linjun; Chen, Shanghuan; Fan, Xuejun; Zhang, Guoqi
Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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7. Experimental analysis of the electromagnetic instruction skip fault model and consequences for software countermeasures. (June 2021)

Authors:: Dutertre, Jean-Max; Menu, Alexandre; Potin, Olivier; Rigaud, Jean-Baptiste; Danger, Jean-Luc
Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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8. Finite element analysis of moisture induced thermo-mechanical delamination of semiconductor packages considering in-situ moisture desorption during reflow process. (June 2021)

Authors:: Hwang, Yeon-Taek; Um, Hui-Jin; Yu, Myeong-Hyeon; Lee, Dae-Woong; Lee, Mi-Jung; Kim, Hak-Sung
Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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9. Monitoring the optical degradation of green light-emitting diodes on the basis of measured electrical characteristics. (June 2021)

Authors:: Herzog, Alexander; Wagner, Max; Khanh, Tran Quoc
Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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10. Passivation-layer thickness and field-plate optimization to obtain high breakdown voltage in AlGaN/GaN HEMTs with short gate-to-drain distance. (June 2021)

Authors:: Iwamoto, Takuma; Akiyama, Seiya; Horio, Kazushige
Journal:: Microelectronics and reliability
Issue:: Volume 121(2021)
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