1. A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs. (November 2017) Authors: Gu, Qi-Lin; Zhang, Peng; Ru, Yi; Song, Hao; Zhao, Wen-Sheng; Yin, Wen-Yan Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 362 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. A newly developed rapid uniform thermal cycle test system for electronic components. (November 2017) Authors: Ikuno, Hajime Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 53 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. A novel multiple-stress-based predictive model of LEDs for rapid lifetime estimation. (November 2017) Authors: Huang, Su-Dan; Zhou, Lin; Cao, Guang-Zhong; Liu, Huai-Yuan; Hu, Yi-Min; Jing, Gang; Cao, Ming-Gao; Xiao, Wen-Peng; Liu, Yan Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 46 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. A novel vertical SCR for ESD protection in 40 V HV bipolar process. (November 2017) Authors: Liu, Fan; Liu, Zhiwei; Liu, Jizhi; Cheng, Hui; Zhao, Liu; Tian, Rui; Song, Shiyu; Liou, Juin J. Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 307 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. A potential gas sensor device based on Pd/RGO/TiO2 nanotube ternary hybrid junction. (November 2017) Authors: Ghosal, S.; Bhattacharyya, P. Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 299 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. A reliable integrative autocorrelator device for particle fluctuation rate monitoring. (November 2017) Authors: Pan, Boan; Li, Ting; Li, Yan; Xu, Guoyi Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 280 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging. (November 2017) Authors: Kung, Huang-Kuang; Hsieh, Chi-Lung Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 272 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment. (November 2017) Authors: Jang, Min-Seok; Ma, Sung Woo; Song, Jongsoo; Sung, Myungmo; Kim, Young-Ho Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 220 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. An efficient reliability testing method combined with thermal performance monitoring. (November 2017) Authors: Hantos, G.; Hegedüs, J.; Rencz, M. Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 126 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Analysis of multifinger power HEMTs supported by effective 3-D device electrothermal simulation. (November 2017) Authors: Chvála, Aleš; Marek, Juraj; Príbytný, Patrik; Šatka, Alexander; Stoffels, Steve; Posthuma, Niels; Decoutere, Stefaan; Donoval, Daniel Journal: Microelectronics and reliability Issue: Volume 78(2017) Page Start: 148 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗