Journal: Microelectronics and reliability / Issue: Volume 78(2017) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Journal Microelectronics and reliability Issue Volume 78(2017)

1. A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs. (November 2017)

Authors:: Gu, Qi-Lin; Zhang, Peng; Ru, Yi; Song, Hao; Zhao, Wen-Sheng; Yin, Wen-Yan
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 362
Record Type:: Journal Article
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2. A newly developed rapid uniform thermal cycle test system for electronic components. (November 2017)

Authors:: Ikuno, Hajime
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 53
Record Type:: Journal Article
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3. A novel multiple-stress-based predictive model of LEDs for rapid lifetime estimation. (November 2017)

Authors:: Huang, Su-Dan; Zhou, Lin; Cao, Guang-Zhong; Liu, Huai-Yuan; Hu, Yi-Min; Jing, Gang; Cao, Ming-Gao; Xiao, Wen-Peng; Liu, Yan
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 46
Record Type:: Journal Article
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4. A novel vertical SCR for ESD protection in 40 V HV bipolar process. (November 2017)

Authors:: Liu, Fan; Liu, Zhiwei; Liu, Jizhi; Cheng, Hui; Zhao, Liu; Tian, Rui; Song, Shiyu; Liou, Juin J.
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 307
Record Type:: Journal Article
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5. A potential gas sensor device based on Pd/RGO/TiO2 nanotube ternary hybrid junction. (November 2017)

Authors:: Ghosal, S.; Bhattacharyya, P.
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 299
Record Type:: Journal Article
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6. A reliable integrative autocorrelator device for particle fluctuation rate monitoring. (November 2017)

Authors:: Pan, Boan; Li, Ting; Li, Yan; Xu, Guoyi
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 280
Record Type:: Journal Article
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7. A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging. (November 2017)

Authors:: Kung, Huang-Kuang; Hsieh, Chi-Lung
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 272
Record Type:: Journal Article
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8. Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment. (November 2017)

Authors:: Jang, Min-Seok; Ma, Sung Woo; Song, Jongsoo; Sung, Myungmo; Kim, Young-Ho
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 220
Record Type:: Journal Article
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9. An efficient reliability testing method combined with thermal performance monitoring. (November 2017)

Authors:: Hantos, G.; Hegedüs, J.; Rencz, M.
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 126
Record Type:: Journal Article
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10. Analysis of multifinger power HEMTs supported by effective 3-D device electrothermal simulation. (November 2017)

Authors:: Chvála, Aleš; Marek, Juraj; Príbytný, Patrik; Šatka, Alexander; Stoffels, Steve; Posthuma, Niels; Decoutere, Stefaan; Donoval, Daniel
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 148
Record Type:: Journal Article
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