Journal: Microelectronics and reliability / Issue: Volume 103(2019) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Journal Microelectronics and reliability Issue Volume 103(2019)

1. A radiation-hardened Sense-Switch pFLASH cell for FPGA. (December 2019)

Authors:: Liu, Guozhu; Li, Bing; Wei, Jinghe; Hong, Genshen; Yu, Zongguang; Wang, Haibin
Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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2. Comparative evaluations on scallop-induced electric-thermo-mechanical reliability of through-silicon-vias. (December 2019)

Authors:: Cheng, Zhiqiang; Ding, Yingtao; Xiao, Lei; Wang, Xinghua; Chen, Zhiming
Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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3. Comparison of holes trapping and protons transport induced by low dose rate gamma radiation in oxide on different SiGe processes. (December 2019)

Authors:: Li, Pei; He, ChaoHui; Guo, HongXia; Zhang, JinXin; Li, YongHong; Wei, JiaNan
Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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4. Controllable micrometer positioning design of piezoelectric actuators using a robust fuzzy eliminator. (December 2019)

Authors:: Chen, Yung-Yue; Lin, Li-Kai; Hung, Min-Hao
Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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5. Determination of current transport and trap states density in AlInGaN/GaN heterostructures. (December 2019)

Authors:: Arslan, Engin; Ural, Sertaç; Altındal, Şemsettin; Özbay, Ekmel
Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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6. Disclosing AlN ceramic substrate process failure mode and effect analysis. (December 2019)

Authors:: Hung, Shiu-Wan; Chen, Ting-Ko
Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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7. Editorial Board. (December 2019)

Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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8. Heat spreading path optimization of IGBT thermal network model. (December 2019)

Authors:: Cui, Haoyang; Hu, Fengye; Zhang, Yu; Zhou, Kun
Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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9. Publisher Note. (December 2019)

Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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Record Type:: Journal Article
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10. Real-time soft error testing system for large-area QDR II+ SRAM array on the Tibetan Plateau. (December 2019)

Authors:: Tong, Teng; Zhang, Zhangang; Wei, Cunfeng; Lei, Zhifeng; Li, Mohan; Li, Daowu; Wang, Peilin; Hu, Tingting; Feng, Baotong; Li, Xiaohui
Journal:: Microelectronics and reliability
Issue:: Volume 103(2019)
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Record Type:: Journal Article
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