1. Analysis of the IGBT Module with Bonding Wire Failure Based on Transient Thermal Impedance. Issue 1 (1st May 2022) Authors: Gao, Jing; Lv, Zhirui; Lu, Yi; Song, Peng; Zhao, Yuan; Xu, Guangda; Yang, Minxiang Journal: Journal of physics Issue: Volume 2276:Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Power Loss Investigation of Si-SiC Hybrid Switches in a Modular Multilevel Converter System. Issue 1 (February 2021) Authors: Mao, Hua; Jiang, Huaping; Hu, Jiayu; Qiu, Guanqun; Ran, Li; Wu, Yuping; Qin, Han; Yang, Minxiang Journal: Journal of physics Issue: Volume 1754:Issue 1(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗