Author/Creator: Xian, Jingwei - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Xian, Jingwei

1. A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. (August 2022)

Authors:: Xu, Yilun; Xian, Jingwei; Stoyanov, Stoyan; Bailey, Chris; Coyle, Richard J.; Gourlay, Christopher M.; Dunne, Fionn P.E.
Journal:: International journal of plasticity
Issue:: Volume 155(2022)
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Record Type:: Journal Article
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2. Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder. (February 2021)

Authors:: Xu, Yilun; Gu, Tianhong; Xian, Jingwei; Giuliani, Finn; Ben Britton, T.; Gourlay, Christopher M.; Dunne, Fionn P.E.
Journal:: International journal of plasticity
Issue:: Volume 137(2021)
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Record Type:: Journal Article
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