A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. (August 2022)

• Record Type: Journal Article
• Authors: Xu, Yilun; Xian, Jingwei; Stoyanov, Stoyan; Bailey, Chris; Coyle, Richard J.; Gourlay, Christopher M.; Dunne, Fionn P.E.
• Is Part Of: International journal of plasticity. Volume 155(2022)
• Publication Date: 2022-08
• Subjects: Crystal plasticity -- Solder joints -- SAC305, thermal fatigue -- Microstructure -- Multi-scale modelling; Plasticity -- Periodicals; Plasticité -- Périodiques; Plasticity; Periodicals; 620.11233
• DOI: 10.1016/j.ijplas.2022.103308
• Languages: English
• ISSNs: 0749-6419

Abstract

Highlights: A multi-scale modelling approach has been presented to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu solder joints of a ball grid array board assembly subject to thermal cycling. Systematic studies of β-Sn crystal orientation and its role in thermal fatigue damage development within solder joints have been shown and compared to experimental observations and analysis. It provides evidence-based optimization for solder microstructural design under in-service thermomechanical fatigue. Abstract: This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue. Graphical abstract: Image, graphical abstract