1. A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC. (September 2017) Authors: Wang, Peizhi; Ge, Peiqi; Li, Zongqiang; Ge, Mengran; Gao, Yufei Journal: Materials science in semiconductor processing Issue: Volume 68(2017) Page Start: 21 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Coping Patterns Among Primary Informal Dementia Caregivers in Singapore and Its Impact on Caregivers—Implications of a Latent Class Analysis. (27th June 2020) Authors: Yuan, Qi; Wang, Peizhi; Tan, Tee Hng; Devi, Fiona; Poremski, Daniel; Magadi, Harish; Goveas, Richard; Ng, Li Ling; Chong, Siow Ann; Subramaniam, Mythily Editors: Meeks, Suzanne Journal: Gerontologist Issue: Volume 61:Number 5(2021) Page Start: 680 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Crack damage control for diamond wire sawing of silicon: The selection of processing parameters. (September 2022) Authors: Ge, Mengran; Chen, Zibin; Wang, Peizhi; Ge, Peiqi Journal: Materials science in semiconductor processing Issue: Volume 148(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Dementia knowledge and its demographic correlates amongst informal dementia caregivers in Singapore. (4th May 2021) Authors: Tan, Gregory Tee Hng; Yuan, Qi; Devi, Fiona; Wang, Peizhi; Ng, Li Ling; Goveas, Richard; Chong, Siow Ann; Subramaniam, Mythily Journal: Aging & mental health Issue: Volume 25:Number 5(2021) Page Start: 864 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide. (15th October 2017) Authors: Wang, Peizhi; Ge, Peiqi; Bi, Wenbo; Ge, Mengran; Liu, Tengyun Journal: Engineering fracture mechanics Issue: Volume 184(2017) Page Start: 273 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Fabrication of thin resin-bonded diamond wire and its application to ductile-mode wire sawing of mono-crystalline silicon. (May 2021) Authors: Ge, Mengran; Wang, Peizhi; Bi, Wenbo; Ge, Peiqi Journal: Materials science in semiconductor processing Issue: Volume 126(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Fracture strength of silicon wafers sawn by fixed diamond wire saw. (15th November 2017) Authors: Liu, Tengyun; Ge, Peiqi; Bi, Wenbo; Wang, Peizhi Journal: Solar energy Issue: Volume 157(2017) Page Start: 427 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Friction Characteristics of Post-Tensioned Tendons of Full-Scale Structures Based on Site Tests. (18th April 2020) Authors: Yuan, Haoyun; Li, Yuan; Zhou, Bin; He, Shuanhai; Wang, Peizhi Other Names: Montuori Rosario Academic Editor. Journal: Advances in civil engineering Issue: Volume 2020(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. In situ fabrication of dry/gel bilayer Ti3C2Tx films for high-rate micro-supercapacitors. Issue 64 (20th July 2022) Authors: Cui, Shuyu; Tang, Jun; Hu, Bihua; Wang, Peizhi; Guo, Jiaxin; Peng, Yuanjun; Wang, Xingzhu; Xu, Baomin Journal: Chemical communications Issue: Volume 58:Issue 64(2022) Page Start: 8954 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Interaction of lateral cracks in double scratching of single-crystal silicon carbide. (December 2019) Authors: Wang, Peizhi; Ge, Peiqi; Bi, Wenbo; Meng, Jianfeng Journal: Theoretical and applied fracture mechanics Issue: Volume 104(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗