1. Wafer‐scale GaN HEMT performance enhancement by diamond substrate integration. Issue 3 (7th February 2014) Authors: Via, G. D.; Felbinger, J. G.; Blevins, J.; Chabak, K.; Jessen, G.; Gillespie, J.; Fitch, R.; Crespo, A.; Sutherlin, K.; Poling, B.; Tetlak, S.; Gilbert, R.; Cooper, T.; Baranyai, R.; Pomeroy, J. W.; Kuball, M.; Maurer, J. J.; Bar‐Cohen, A. Other Names: Eddy, Jr. Charles R. "Chip" sponsoringEditor.; Kuball Martin sponsoringEditor.; Koleske Daniel D. sponsoringEditor.; Amano Hiroshi sponsoringEditor. Journal: Physica status solidi Issue: Volume 11:Issue 3/4(2014:Apr.) Page Start: 871 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗