1. Effect of thermal cycle stress on universal adhesive systems. (2016) Authors: Ito, M.; Okada, N.; Shiga, H.; Sakurai, H.; Tetsuya, K.; Ryousuke, Y.; Noda, M. Journal: Dental materials Issue: Volume 32(2016)Supplement 1 Page Start: e27 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗