Effect of thermal cycle stress on universal adhesive systems. (2016)

Record Type:: Journal Article
Title:: Effect of thermal cycle stress on universal adhesive systems. (2016)
Main Title:: Effect of thermal cycle stress on universal adhesive systems
Authors:: Ito, M.
Okada, N.
Shiga, H.
Sakurai, H.
Tetsuya, K.
Ryousuke, Y.
Noda, M.
Abstract:
Is Part Of:: Dental materials. Volume 32(2016)Supplement 1
Journal:: Dental materials
Issue:: Volume 32(2016)Supplement 1
Issue Display:: Volume 32, Issue 1 (2016)
Year:: 2016
Volume:: 32
Issue:: 1
Issue Sort Value:: 2016-0032-0001-0000
Page Start:: e27
Page End:
Publication Date:: 2016
Subjects:: Dentistry -- Periodicals
Dental materials -- Periodicals
617.695
Journal URLs:: http://www.elsevier.com/journals ↗
http://www.sciencedirect.com/science/journal/01095641/ ↗
DOI:: 10.1016/j.dental.2016.08.053 ↗
Languages:: English
ISSNs:: 0109-5641
Deposit Type:: Legaldeposit
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library DSC - 3553.365800
British Library DSC - BLDSS-3PM
British Library STI - ELD Digital store
Ingest File:: 1170.xml